InPsytech Showcases 3nm UCIe 3.0 Technology
InPsytech, a subsidiary of Egis Technology, announced its participation in the Open Compute Project (OCP) Global Summit 2025.
The company will showcase its latest 3nm UCIe high-speed interface technology demo, featuring support for the newest UCIe 3.0 standard.
- 3D packaging integration
- Ultra-high-speed, low-power performance
This demonstration highlights InPsytech's advanced R&D capabilities in Chiplet interconnect technology.
InPsytech's technology supports Egis Group's broader strategy in semiconductor design and heterogeneous integration.
Author's summary: InPsytech presents 3nm UCIe tech.